Vibration Isolation Case Studies

Tier-1 Semiconductor Icheon Applied Materials PROVision 10 DVIA-P7000 Installation Report

DVIA-ML1000 second tuning in Shanghai (serial 251023R6): DSP board issue diagnosed, board replaced, then re-tuned — first visit 2025-01-13, second visit January 19, 2026. PXB-BE-200HV (Turned on / IDLE). Field form lists N/A for vibration specification; measurement summary compares floor vs DVIA-ML1000 VC at dominant frequencies. VC, Autospectrum, Transmissibility per axis; on-site equipment shown as one vertically stacked composite image.

DVIA-P4000 (serial 251105R3) installation report at ETRI for Hitachi CS5000: measurement on 2026-01-14 with equipment Turned off. Published figures include equipment specification capture and VC / autospectrum / transmissibility plots for vertical, left-to-right, and front-to-back axes.

Tier-1 Semiconductor Icheon R3 Applied Materials PROVision 10 DVIA-P7000 inspection report: retuning after vibration alarm, VC and transmissibility measurements.

YIMO-format report — SN 250923R2, ZEISS Sigma 300 FE-SEM. Vibration spec diagram, UI Autospectrum and Transmissibility (Z / L–R / F–B) plus equipment photo.

DVIA-ULF1000 (S/N 251112R4) installation and vibration measurement at Tier-1 Semiconductor Fabrication Facility DSR C Tower 3F research lab with ZEISS GeminiSEM 460 FE-SEM.