Vibration Isolation Case Studies

DVIA-M1000 serial 231204R4 — handout for Suzhou Tongguan Microelectronics, target equipment ZEISS SEM Sigma360, installation Suzhou. Overview and measurement details match the published form; M1000 internal program performance plots labeled Vertical, Left to Right, and Front to Back from the UI program. Cover-only header graphics are not republished.

JEOL JEM-F200 TEM DVIA-MB3000 Installation

DVIA-P4000 operation report (serial 240424R1) for ASML E-beam wafer inspection system eScan 460 at Wuxi, China via YIMO Technology. Equipment uninstalled; vibration specification VC-D in all axes. Report written 24.09.03 by Chaewon Lee. Published top-plate and floor accelerometer sensor data confirming normal platform operation after installation.

DVIA-P2200 (serial 240501R1) installation report at Kyungpook National University Semiconductor Fusion Research Building B1 with JEOL JBX-8100FS electron beam lithography. Tuning and vibration measurement on September 3, 2024; engineer Chaewon Lee (DAEIL SYSTEMS). Published equipment vibration specification diagram and axis VC, narrowband, and transmissibility plots. Reference uses the Generic Vibration Criteria markdown table only.

TESCAN Solaris X FIB-SEM DVIA-ML1000 Installation

DVIA-M1000 installation report (serial 240704R3-1) for ZEISS SEM EVO 10 via YIMO. Overview matches the published form. Equipment condition: The equipment is installed. Published figures include UI-program plots as listed; Reference uses the standard Generic Vibration Criteria markdown table.