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Vibration Isolation Case Studies

DAEIL SYSTEMS engineers active vibration isolation systems for the world's most demanding nanoscale imaging and metrology environments.

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455 case studies
Geely Chunxiao Ningbo ZEISS Gemini DVIA-MB1000 (170713R5) China trip report — 2017.12.08

Trip report for MB1000 Set up-170713R5 at Geely Chunxiao Manufacturing Plant (China Ningbo, factory R&D building 1F) with target equipment ZIESS Gemini. Business trip 2017-12-06, operator Lim Jong-wook, report dated 2017-12-08. Publishes the installation photograph after the title block, the VC-Class summary grid as issued, MB1000 internal-program screens, vibration-environment measurement screens, and SEM comparison (Floor vs Active). Decorative top banner raster (DOCX image1) is omitted.

Hangzhou China DVIA-MB1000 (170906R4) Business Trip Report — ZIESS EVO18 Special Edition — 2017.12.08

DVIA-MB1000 setup serial 170906R4 at a Wangxiang automotive-parts site in Hangzhou, China: installation-result VC table, site context photograph, MB1000 internal-program captures for Z/X/Y, and vibration-environment measurement plots for Z/X/Y. The small logo strip before the report title and the large graphic directly under the title line are omitted from the public page as header or title-block decoration.

ZEISS SIGMA 300 DVIA-MB1000 (MB1000_P53) Internal program — Tier-1 Semiconductor — Philippines — 2017.11.13

Korean-format MB1000_P53 trip report for ZEISS-SIGMA 300 at a Tier-1 Semiconductor Manila analysis laboratory (2nd floor): business trip 2017-11-07–11, measurement 2017-11-08, report written 2017-11-13 by Manager Choi, Hyoung Mun (DAEIL SYSTEMS). Publishes the post-title installation photograph (decorative title-strip raster omitted), VC-Class summary under general SEM-pump-on conditions, MB1000 internal-program Z/X/Y captures, and two octave-band blocks (floor vs isolator top; isolator top vs ZEISS stage) in source order.

Tier-1 Semiconductor ZEISS SIGMA 300 DVIA-MB1000 (MB1000 P53) Installation Report — 2017.11.13

MB1000 P53 handout for a ZEISS SIGMA 300 site at a Tier-1 Semiconductor Manila analysis laboratory (2F). Trip 2017-11-07 — 2017-11-11; measurement 2017-11-08; report 2017-11-13 by Choi, Hyoung Mun (DAEIL SYSTEMS). VC-class summary table, MB1000 internal-program plots per axis, and octave-band and acceleration spectra (building floor vs isolator top vs ZEISS equipment top).

Qualcomm ZEISS CROSSBEAM 540 DVIA-M1000 (MB1000) Installation test data (2017-10-26)

Archived handout-style “Installation Test Data” for a ZEISS CROSSBEAM 540 at Qualcomm on DVIA-M (MB1000). Installation and measurement date 2017-10-24; reporting date 2017-10-26; engineer CHOI, HYOUNGMUN. Published imagery: equipment view after the title block, then Z/X/Y transmissibility with coherence plots and Z/X/Y octave-band plots. No vibration-criteria VC curves or measurement summary table appear in the source document.

HITACHI SU8230 SEM DVIA-MB1000 (MB1000_P52) Vibration Survey — Tier-1 Semiconductor — 2017.09.12

Korean worksheet MB1000_P52 for a HITACHI SU8230 SEM at a Tier-1 Semiconductor facility in Daejeon: trip and report metadata, overview, measurement date and operator, site and equipment model, measurement conditions, VC-Class summary table (floor vs platform), narrative summary lines, VC-Class environment plots for Z/X/Y, and MB1000 internal-program transmissibility plots for Z/X/Y. Measurement 2017-09-11; report 2017-09-12; operators Choi, Hyoung Mun (manager) and Kim, Doo Hyun (assistant manager), DAEIL SYSTEMS. Decorative centred banner raster before the printed title block is not republished.