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Vibration Isolation Case Studies

DAEIL SYSTEMS engineers active vibration isolation systems for the world's most demanding nanoscale imaging and metrology environments.

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455 case studies
Tier-1 Semiconductor Cheonan C5 ZEISS Crossbeam 550 FIB-SEM DVIA-ML1000 (240710R2) Installation Report

DVIA-ML1000 installation report (serial 240710R2) for ZEISS FIB-SEM Crossbeam 550 at Tier-1 Semiconductor Cheonan C5. Overview describes on-site tuning and vibration measurement with the tool in IDLE after placement; measurement setup and equipment vibration limit VC-E appear in the specification capture. Measurement Summary includes a vertical floor line FAIL with platform PASS; horizontal axes PASS. Published plots: vibration specification capture, VC / Autospectrum / Transmissibility by axis. Reference uses the standard Generic Vibration Criteria markdown table only (no separate reference graphic).

Tier-1 Semiconductor ZEISS Versa 630 3D X-ray Microscope DVIA-MB3000 (241011R1) Installation Report — 2024.11.27

DVIA-MB3000 (serial 241011R1) on-site tuning and vibration worksheet at Tier-1 Display Manufacturer Giheung. Measurement curves and UI plots are not published on this page owing to customer site data-handling restrictions; the written findings, measurement summary table, and the equipment vibration specification diagram from the installation report are provided. DAEIL SYSTEMS field engineer Chae-won Lee; report written 2024.11.29.

Yonsei University Unisoki Low Temperature SPM USM1200 DVIA-ML1000 (240821R5) Installation Report

DVIA-ML1000 installation report (serial 240821R5) for Unisoki Low Temperature SPM USM1200 at Yonsei University Quantum Imaging Laboratory, Advanced Science and Technology Research Building. Tuning and vibration measurement on November 19, 2024; report dated November 21, 2024. Engineer Chaewon Lee (DAEIL SYSTEMS). Equipment status: 장비 설치 및 IDLE. Brüel & Kjær LAN-XI DAQ Type 3050 and PCB 393B05 accelerometer; measurement setup 200 Hz span, 800 lines, Hanning, m/s. Conclusion states all axes meet the vibration specification and notes amplification in some bands is inherent USM1200 vibration. Measurement summary PASS all axes. Published plots: vibration specification UI, VC / Autospectrum / Transmissibility for Vertical, Left to Right, and Front to Back, plus equipment photo. Reference uses the standard Generic Vibration Criteria markdown table only (no separate reference graphic).

Korea Electronics and Machinery Convergence Technology Institute DVIA-MB3000 (141104R5) Installation Report — 2024.11.15

DVIA-MB3000 (serial 141104R5) inspection and tuning after relocation to Korea Electronics and Machinery Convergence Technology Institute, Room 104, with measurement on 31 Oct 2024 and report dated 15 Nov 2024. Equipment not yet installed; VC-curve, autospectrum, and transmissibility plots for vertical, left-to-right, and front-to-back axes; measurement summary per the site worksheet; equipment vibration specification TBD (미정). Engineers Chae-won Lee (field) and Dong-hwan Kim (domestic sales), DAEIL SYSTEMS. Reference uses the standard Generic Vibration Criteria markdown table (no separate reference figure).

Tier-1 Semiconductor ZEISS TEM 630 VERSA DVIA-MB3000 (171201R2) Installation Report — 2024.11.11

DVIA-MB3000 (serial 171201R2) on-site vibration worksheet dated 2024.11.11 at Tier-1 Semiconductor with upper-platform equipment Turned off: passive setting, active tuning, and vibration measurements. VC-curve plots for floor vs platform (passive control off and DVIA-MB3000 Active On), measurement summary table, equipment vibration specification diagram, and Reference as a markdown Generic Vibration Criteria table (no separate reference figure). Engineer Jung Sung-yoon (DAEIL SYSTEMS); report written 2024.11.18.

Thermo Fisher Spectra 300 S/TEM DVIA-STONE-300 — Shenzhen Weiguang, 2024-11-05

Shenzhen Weiguang — Thermo Fisher Spectra 300 S/TEM with DVIA-STONE-300 internal program performance screenshots (Vertical, Left to Right, Front to Back) from the 2024.11.05 measurement; reporting dated 2024.11.06. Facility photograph from the worksheet before the summary table is included. Engineer Chaewon Lee (DAEIL SYSTEMS).