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Installation Report
DVIA-M Series
12-09-2024

Tier-1 Semiconductor Cheonan C5 ZEISS Crossbeam 550 FIB-SEM DVIA-ML1000 (240710R2) Installation Report

DVIA-M Series
Installation Report
Tier-1 Semiconductor
Cheonan
ZEISS
FIB-SEM
Crossbeam 550
DVIA-ML1000
240710R2

Overview

Tuning and vibration measurements were performed for the DVIA-ML1000 installed at Tier-1 Semiconductor Cheonan site. After the tool was placed, vibration measurement and tuning were carried out with the equipment in IDLE state. Data are presented as VC curves, and reference information on vibration levels is provided.

Vibration Isolation System Info

Model: DVIA-ML1000

Serial Number: 240710R2

Engineer

Chaewon Lee — DAEIL SYSTEMS field engineer

Tuning Date

December 6, 2024

Report written date

December 9, 2024

End User

Tier-1 Semiconductor Cheonan site

Number of Tuning Trial

N/A

Location

Tier-1 Semiconductor Cheonan site, Building C5

Equipment

Manufacturer: ZEISS

Equipment: FIB-SEM

Model: Crossbeam 550

Measurement Device

Data Physics DAQ — Hardware: QUATTRO, Serial Number: 22436; Software: SignalCalc ACE

Accelerometer — PCB, Model: 393B05

Measurement Setup

F Span: 200 Hz

Lines: 3200

Engineering Units: m/s

Window: Hanning

Averaging: FFT Spectrum Averaging

Averaging mode: Exponential, 40

Vibration Specification

Equipment Condition

Equipment installed/IDLE

Conclusion

All directions satisfy the equipment vibration specification.

Measurement Summary

Measurement PointStatusAxisVibration specificationFloorDVIA-ML1000ResultResult
Tier-1 Semiconductor Cheonan C5
1. Floor
2. DVIA-ML1000
Equipment installed/IDLEVerticalVC-EVC-D @ 10 HzVC-G @ 10 HzFAILPASS
Tier-1 Semiconductor Cheonan C5
1. Floor
2. DVIA-ML1000
Equipment installed/IDLELeft to RightVC-FVC-F @ 3.15 HzVC-G @ 3.15 HzPASSPASS
Tier-1 Semiconductor Cheonan C5
1. Floor
2. DVIA-ML1000
Equipment installed/IDLEFront to BackVC-FVC-F @ 4 HzVC-G @ 4 HzPASSPASS

Data and Image

Vertical VC Curves

Vertical Autospectrum

Vertical Transmissibility

Left to Right VC Curves

Left to Right Autospectrum

Left to Right Transmissibility

Front to Back VC Curves

Front to Back Autospectrum

Front to Back Transmissibility

Reference

Generic Vibration Criteria

Criterion CurveDescriptionAmplitude
μm/s (µin/s)
Detail Size
μm
Workshop (ISO)Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.800 (32,000)N/A
Office (ISO)Perceptible vibration. Appropriate to offices and non-sensitive areas.400 (16,000)N/A
Residential Area (ISO)Barely perceptible vibration. Appropriate to sleep areas in most instances.200 (8,000)75
Operating Theatre (ISO)Vibration not perceptible. Suitable for surgical suites, microscopes to 100x.100 (4,000)25
VC-AAdequate for optical microscopes to 400x, microbalances, optical balances.50 (2,000)8
VC-BAppropriate for inspection and lithography equipment to 3μm line widths.25 (1,000)3
VC-CAppropriate for optical microscopes to 1000x, lithography equipment to 1μm.12.5 (500)1 - 3
VC-DSuitable for demanding equipment including electron microscopes (SEMs/TEMs).6.25 (250)0.1 - 0.3
VC-EFor the most demanding systems including E-Beam lithography at nanometer scales.3.12 (125)< 0.1
VC-FFor extremely quiet research spaces. Not recommended as design criterion.1.56 (62.5)N/A
VC-GFor extremely quiet research spaces. Not recommended as design criterion.0.78 (31.25)N/A

Notes:

- As measured in one-third octave bands over 8-80 Hz (VC-A/B) or 1-80 Hz (VC-C through VC-G).

- Detail size refers to width in microelectronics fabrication or particle size in medical research.

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Case Study Information

Category
Installation Report
SeriesDVIA-M Series
Date12-09-2024
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
Cheonan
ZEISS
FIB-SEM
Crossbeam 550
DVIA-ML1000
240710R2