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Installation Report
DVIA-M Series
11-11-2024

Tier-1 Semiconductor ZEISS TEM 630 VERSA DVIA-MB3000 (171201R2) Installation Report — 2024.11.11

DVIA-M Series
Installation Report
Tier-1 Semiconductor
ZEISS
TEM
630 VERSA
DVIA-MB3000
171201R2

Overview

At Tier-1 Semiconductor, with the upper isolator equipment Turned off, passive setting, active tuning, and vibration measurements were performed on the platform. Measured vibration is plotted on VC curves and reference material on vibration levels is provided.

Engineer

Jung Sung-yoon, DAEIL SYSTEMS

Measurement date

11 November 2024

Report written date

2024.11.18

Measurement site

Tier-1 Semiconductor R&D building, 1st floor

Customer equipment

Manufacturer: ZEISS

Equipment: TEM

Model: 630 VERSA

Vibration measurement instruments

5.1) Data Physics

Hardware: QUATTRO DP240

Software: SignalCalc ACE

5.2) Accelerometer

PCB Accelerometer

Model: 393B05

Measurement setup

F Span: 200

Lines: 3200

Window: Hanning

Averaging: FFT Spectrum Averaging

Engineering Units: m/s2

Equipment vibration specification

Conclusion

The maximum VC-C vibration is measured on the floor. With the isolator Active On, vibration below VC-G is measured in all three directions.

Measurement result summary

Measurement positionDirectionVibration Spec.MeasuredResult
FloorVerticalVC-CVC-CPASS
FloorFront to backVC-CVC-EPASS
FloorLeft to rightVC-CVC-EPASS
Platform top (DVIA-MB3000 Active On)VerticalVC-CVC-GPASS
Platform top (DVIA-MB3000 Active On)Front to backVC-CVC-GPASS
Platform top (DVIA-MB3000 Active On)Left to rightVC-CVC-GPASS

Data and Image

Passive control off (Passive) — Vertical

Passive control off (Passive) — Front to back

Passive control off (Passive) — Left to right — VC curves

Passive control off (Passive) — Left to right — Autospectrum

Passive control off (Passive) — Left to right — Transmissibility

Active control on — Vertical — VC curves

Active control on — Vertical — Autospectrum

Active control on — Vertical — Transmissibility

Active control on — Front to back

Active control on — Left to right

Reference

Generic Vibration Criteria

Criterion CurveDescriptionAmplitude
μm/s (µin/s)
Detail Size
μm
Workshop (ISO)Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.800 (32,000)N/A
Office (ISO)Perceptible vibration. Appropriate to offices and non-sensitive areas.400 (16,000)N/A
Residential Area (ISO)Barely perceptible vibration. Appropriate to sleep areas in most instances.200 (8,000)75
Operating Theatre (ISO)Vibration not perceptible. Suitable for surgical suites, microscopes to 100x.100 (4,000)25
VC-AAdequate for optical microscopes to 400x, microbalances, optical balances.50 (2,000)8
VC-BAppropriate for inspection and lithography equipment to 3μm line widths.25 (1,000)3
VC-CAppropriate for optical microscopes to 1000x, lithography equipment to 1μm.12.5 (500)1 - 3
VC-DSuitable for demanding equipment including electron microscopes (SEMs/TEMs).6.25 (250)0.1 - 0.3
VC-EFor the most demanding systems including E-Beam lithography at nanometer scales.3.12 (125)< 0.1
VC-FFor extremely quiet research spaces. Not recommended as design criterion.1.56 (62.5)N/A
VC-GFor extremely quiet research spaces. Not recommended as design criterion.0.78 (31.25)N/A

Notes:

- As measured in one-third octave bands over 8-80 Hz (VC-A/B) or 1-80 Hz (VC-C through VC-G).

- Detail size refers to width in microelectronics fabrication or particle size in medical research.

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Case Study Information

Category
Installation Report
SeriesDVIA-M Series
Date11-11-2024
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
ZEISS
TEM
630 VERSA
DVIA-MB3000
171201R2