Vibration Isolation Case Studies

DVIA-MB3000 (serial 231005R2) installation report dated 27 December 2023 at Tier-1 Semiconductor with ZEISS Xradia 620 Versa X-ray Microscope: Summary of vibration results table (Floor vs Active VC curve grades across axis bands), VC curves for Floor and Active states per axis, and Reference diagrams with explanatory notes comparing VC curves and Modified Mercalli intensity. Engineer Jongwon Park (DAEIL SYSTEMS); tuning date and report written date 23.12.27.

Tier-1 Semiconductor Giheung SR1 ZEISS AIMS 1X DVIA-P4000 (190104R4) inspection report comparing equipment IDLE and power-off vibration and transmissibility.

Tier-1 Semiconductor Giheung SR1 Bruker AFM NM-VI DVIA-P4000 inspection report (serial 200805R3)

IST-format handout — DVIA-M1000 serial 230927R4 with ZEISS FE-SEM Gemini 560 at Shanghai (setup 2023-12-18, report written 2023-12-19). Published figures from the IST document: bench installation photograph and M1000 UI results for Z, X, and Y axes.

Tier-1 Semiconductor Advanced Institute SAIT Cleanroom Building A: DVIA-P7000 (140416R6-2) inspection on Nikon NSR-2205i12D stepper with IDLE-state vibration measurement, VC summary, transmissibility, and sensor checks.

SHOWA-format inspection and vibration measurement report (inspection December 14, 2023; written December 18, 2023) for VAAV-4000H serial 036174 (SAC-07) at Tier-1 Semiconductor Hwaseong NRD Line 8F with Bruker AFM NM-4. Publishes VC summary table (Floor vs Active), displacement and accelerometer graphs, axis transmissibility and VC curves, regulator and unit photographs from the source document.