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Installation Report
DVIA-M Series
12-17-2021

Carl Zeiss ZEISS-Xradia 620 Versa DVIA-MB3000 (MB3000_P24) Worksheet — Tier-1 Semiconductor — 2021.12.17

DVIA-M Series
Installation Report
Carl Zeiss
ZEISS-Xradia 620 Versa
DVIA-MB3000
MB3000_P24
Tier-1 Semiconductor

Target equipment

ZEISS-Xradia 620 Versa

Place of installation

SK이노베이션 3-2건물 지하 1층

Remark

Good Performance

End User

Tier-1 Semiconductor

Operator

Operator: Choi, HyoungMun

Date of setup

21.12.16

Date of reporting

21.12.17

Date of business trip

Date of business trip : 17.12.27~17.12.29

Overview

After Active mounting, measure the vibration environment to check that there is no problem in using the equipment.

Measurement date

Measurement date: 21.12.16 (Thur)

Operator: Daeil System, Research engineer Choi, HyoungMun

Place of measurement

Place of measurement : SK이노베이션 3-2건물 지하 1층

Equipment Model

ZEISS-Xradia 620 Versa

Measurement conditions and results

DAQ System : Data Physics- QUATTRO & Signalcalc Ace

Accelerometer : PCB PIEZOTRONICS 393B05

Frequency Range : 0.7 ~ 200Hz

Measurement conditions (graphics)

Condition graphic 1

Condition graphic 2

Condition graphic 3

Summary of measurement results

Test ConditionZXY
FloorFGG
Above ActiveFDF

Field notes

All axes show satisfactory performance. (During performance checks, each axis was excited to conduct the checks.)

The installed floor is basement-1 concrete and the vibration environment is very good.

Due to equipment vibration, the active top surface appears slightly less favorable than the floor.

Field notes (graphics)

Field note graphic 1

Field note graphic 2

MB3000 internal program performance measurement result

Z axis (internal program)

X axis (internal program)

Y axis (internal program)

Vibration criterion curve

Z axis

X axis

X-axis Top

Y axis

Y-axis Top

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Case Study Information

Category
Installation Report
SeriesDVIA-M Series
Date12-17-2021
Tags
DVIA-M Series
Installation Report
Carl Zeiss
ZEISS-Xradia 620 Versa
DVIA-MB3000
MB3000_P24
Tier-1 Semiconductor