Installation Report
DVIA-M Series
10-21-2020
Tier-1 Semiconductor FEI TF20 TEM DVIA-MB3000 (200623R1) Installation Worksheet — 2020.10.21
DVIA-M Series
Installation Report
Tier-1 Semiconductor
FEI
TEM
TF20
DVIA-MB3000
200623R1
Contents
Overview
After Active mounting, measure the vibration environment to check that there is no problem in using the equipment.
Measurement date: 20.10.21 (WED)
Operator: Daeil System, Research engineer Choi, HyoungMun
Place of measurement :
Equipment Model: TF20-FEI TEM
Vibration Isolation System Information
Model: DVIA-MB3000
Serial Number: 200623R1
Engineer
Choim, HyoungMun
Date of setup
20.10.21
Date of reporting
20.10.22
Date of business trip
17.12.27~17.12.29
End user
N/A
Place of installation
N/A
Remark
N/A
Target equipment
TF20-FEI TEM
Measurement conditions and results
Summary of measurement results
Transmissibility
| 2 Hz | 5 Hz | 10 Hz | |
|---|---|---|---|
| Z | -20 dB | -25 dB | -22 dB |
| X | -20 dB | -20 dB | -23 dB |
| Y | -26 dB | -25 dB | -25 dB |
Good omnidirectional performance.
MB1000 internal program performance measurement result
Data and Image
Installation photograph
Z axis
X axis
Y axis
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Case Study Information
Category
Installation Report
SeriesDVIA-M Series
Date10-21-2020
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
FEI
TEM
TF20
DVIA-MB3000
200623R1
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