Installation Report

DVIA-M Series

04-23-2026

YIMO TECH Qingdao Aviation Innovation Base Ciqtek SEM660F FIB-SEM DVIA-ML1000 Installation Report

DVIA-M Series

Installation Report

YIMO TECH

Qingdao Aviation Technology Industry Innovation Base

Ciqtek

FIB-SEM

SEM660F

DVIA-ML1000

240411R7

Qingdao

Overview

The DVIA-ML1000 active vibration isolation platform is appropriately installed and functioning as intended.

A cooling fan is installed beneath the equipment, and the airflow from the fan blows onto the DVIA-ML1000, which affects its performance.

Vibration Isolation System Information

Model: DVIA-ML1000

Serial Number: 240411R7

Engineer

Chaewon Lee DAEIL SYSTEMS

Tuning Date

April 20, 2026

Report written date

26.04.23

End User

Qingdao Aviation Technology Industry Innovation Base

Number of Tuning Trial

3rd

Location

Qingdao, China

Equipment

Manufacturer: Ciqtek

Equipment: FIB-SEM

Model: SEM660F

Vibration Specification

N/A

Equipment Condition

The equipment is turned on/IDLE

Tuning Request

N/A

Measurement Summary

Measurement Point	Status	Axis	Measurement Data
Measurement Point	Status	Axis	Floor	DVIA-ML1000
1.Floor 2.DVIA-ML1000	Equipment is Turned on/IDLE	Vertical	VC-E @ 31.5 Hz	VC-G @ 31.5 Hz
		Left to Right	VC-G @ 4 Hz	VC-G @ 4 Hz
		Front to Back	VC-G @ 31.5 Hz	VC-G @ 31.5 Hz

Measurement Data Obtained via UI Program

Vertical VC Curves

Vertical Autospectrum

Vertical Transmissibility

Left to Right VC curves

Left to Right Autospectrum

Left to Right Transmissibility

Front to Back VC Curves

Front to Back Autospectrum

Front to Back Transmissibility

Equipment picture

Reference

Criterion Curve	Description of Use	Amplitude μm/s (µin/s)	Detail Size μm
Workshop (ISO)	Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.	800 (32,000)	N/A
Office (ISO)	Perceptible vibration. Appropriate to offices and non-sensitive areas.	400 (16,000)	N/A
Residential Area (ISO)	Barely perceptible vibration. Appropriate to sleep areas in most instances. Usually adequate for computer equipment, hospital recovery rooms, semiconductor probe test equipment, and microscopes less than 40x.	200 (8,000)	75
Operating Theatre (ISO)	Vibration not perceptible. Suitable in most instances for surgical suites, microscopes to 100x and for other equipment of low sensitivity.	100 (4,000)	25
VC-A	Adequate in most instances for optical microscopes to 400x, microbalances, optical balances, proximity and projection aligners, etc.	50 (2,000)	8
VC-B	Appropriate for inspection and lithography equipment (including steppers) to 3µm line widths.	25 (1,000)	3
VC-C	Appropriate standard for optical microscopes to 1000x, lithography and inspection equipment (including moderately sensitive electron microscopes) to 1µm detail size. TFT-LCD stepper/scanner processes.	12.5 (500)	1 - 3
VC-D	Suitable in most instances for demanding equipment, including many electron microscopes (SEMs and TEMs) and E-Beam systems.	6.25 (250)	0.1 - 0.3
VC-E	A challenging criterion to achieve. Assumed to be adequate for the most demanding of sensitive systems including long path, laser-based, small target systems, E-Beam lithography systems working at nanometer scales, and other systems requiring extraordinary dynamic stability.	3.12 (125)	< 0.1
VC-F	Appropriate for extremely quiet research spaces; generally difficult to achieve in most instances, especially cleanrooms. Not recommended for use as a design criterion, only for evaluation.	1.56 (62.5)	N/A
VC-G	Appropriate for extremely quiet research spaces; generally difficult to achieve in most instances, especially cleanrooms. Not recommended for use as a design criterion, only for evaluation.	0.78 (31.3)	N/A

Notes:

1. As measured in one-third octave bands of frequency over the frequency 8 to 80 Hz (VC-A and VC-B) or 1 to 80 Hz (VC-C through VC-G).

2. The detail size refers to line width in the case of microelectronics fabrication, the particle (cell) size in the case of medical and pharmaceutical research, etc.

3. The detail size is not relevant to imaging associated with probe technologies, AFMs, and nanotechnology.