Skip to main content
Installation Report
DVIA-P Series
01-22-2026

Tier-1 Semiconductor Icheon Applied Materials PROVision 10 DVIA-P7000 Installation Report

DVIA-P Series
Installation Report
Tier-1 Semiconductor
Applied Materials
PROVision 10

Overview

Tuning and vibration measurement were performed on the DVIA-P7000 installed at Tier-1 Semiconductor Icheon R4 36 bay (RMHT3601).

Tuning and vibration measurement were conducted with the equipment Turned off.

Data are presented as VC curves, along with reference materials for vibration levels.

Vibration Isolation System Information

Model: DVIA-P7000

Serial Number: 251027R8

Engineer

Chaewon Lee, DAEIL SYSTEMS Field Engineer; Seongyun Jeong, Development Team

Inspection Date

January 22, 2026

Installation Site

Tier-1 Semiconductor Icheon R4 36 bay (RMHT3601)

End User

Tier-1 Semiconductor

Equipment

Manufacturer: Applied Materials

Equipment: 3E eBeam Metrology

Model: PROVision 10

Equipment Specification

Equipment Status

Equipment is mounted on the vibration isolation platform and Turned off

Measuring Equipment

10.1) Brüel & Kjær LAN-XI DAQ Type 3040 DAQ

Hardware: B&K Front End Type 3040-A-040

Software: B&K Pulse Labshop 22 Version

10.2) Accelerometer

PCB Accelerometer

Model: 393B05

Measuring Set-up

F Span: 200 Hz

Lines: 3200

Averaging: Spectrum Averaging

Engineering Units: m/s

Window: Hanning

Overlap: Max

Conclusion

After installation, the mechanical installation condition of the vibration isolation system was inspected, and basic utilities required for platform operation were configured through CDA and power connections.

Sensor and actuator signal status was checked, and initial control parameters suited to the site environment were applied for the first tuning.

Under DVIA-P7000 Active On conditions, the equipment vibration specification was confirmed to be satisfied in all directions.

Measurement Data

Measuring PointEquipment StatusDirectionVibration SpecificationMeasurement (floor)Measurement (DVIA-P7000)Result (floor)Result (DVIA-P7000)
Tier-1 Semiconductor M16 10F C2 bay (6MHTC201)
1. Floor vibration measurement
2. DVIA-P7000
Equipment is mounted on the vibration isolation platform and Turned offVerticalVC-DVC-B
@ 100 Hz
VC-E
@ 100 Hz
FAILPASS
Left to RightVC-C
@ 50 Hz
VC-G
@ 50 Hz
FAILPASS
Front to BackVC-E
@ 63 Hz
VC-G
@ 63 Hz
PASSPASS

Data and Image

Vertical VC Curves

Vertical Autospectrum

Vertical Transmissibility

Left to Right VC Curves

Left to Right Autospectrum

Left to Right Transmissibility

Front to Back VC Curves

Front to Back Autospectrum

Front to Back Transmissibility

Reference

Criterion CurveDescriptionAmplitude
μm/s (µin/s)
Detail Size
μm
Workshop (ISO)Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.800 (32,000)N/A
Office (ISO)Perceptible vibration. Appropriate to offices and non-sensitive areas.400 (16,000)N/A
Residential Area (ISO)Barely perceptible vibration. Appropriate to sleep areas in most instances.200 (8,000)75
Operating Theatre (ISO)Vibration not perceptible. Suitable for surgical suites, microscopes to 100x.100 (4,000)25
VC-A400x optical microscope, microbalance, optical balance.50 (2,000)8
VC-B3 µm linewidth inspection and lithography equipment.25 (1,000)3
VC-C1000x optical microscope, 1 µm lithography equipment.12.5 (500)1 – 3
VC-DSEM/TEM, etc. Difficult equipment.6.25 (250)0.1 – 0.3
VC-EE-Beam lithography, etc. Most difficult system.3.12 (125)< 0.1
VC-FExtremely quiet research area. Not recommended as a design standard.1.56 (62.5)N/A
VC-GExtremely quiet research area. Not recommended as a design standard.0.78 (31.25)N/A

Notes:

1. VC-A/B is measured in 1/3 octave bands from 8–80 Hz, VC-C through VC-G from 1–80 Hz.

2. Detail size refers to line widths in microelectronics manufacturing or particle sizes in medical research.

Share this Case Study

Case Study Information

Category
Installation Report
SeriesDVIA-P Series
Date01-22-2026
Tags
DVIA-P Series
Installation Report
Tier-1 Semiconductor
Applied Materials
PROVision 10