Tier-1 Semiconductor Cheonan C5 ZEISS Versa Xradia 630 Versa DVIA-ML3000 (250917R1) Installation Report
Contents
Overview
Tuning and vibration measurements were conducted for the DVIA-ML3000 installed at Tier-1 Semiconductor Cheonan campus C5 Analysis Room 3, YEC FE-SEM unit 3.
Work was performed with the customer tool Turned On / IDLE, and normal operation was verified.
Vibration checks used VC grades against the equipment specification; under the customer security policy, external distribution of vibration measurement data is restricted, so measurement curves are omitted from the published report.
Vibration Isolation System Information
Model: DVIA-ML3000
Serial number: 250917R1
Engineer
Seongyoon Jeong — DAEIL SYSTEMS Development Team (per report)
Service date
December 17, 2025
Report written date
January 6, 2026
Installation site
Tier-1 Semiconductor Cheonan campus C5 Analysis Room 3
End user
Tier-1 Semiconductor
Equipment
Manufacturer: ZEISS
Equipment: X-ray Microscope
Model: Versa Xradia 630 Versa
Equipment specification
Equipment status
Turned On / IDLE
Measuring equipment
10.1) Brüel & Kjær LAN-XI DAQ Type 3050 DAQ
-Hardware: B&K Front End Type 3050-A-040
-Software: B&K Pulse Labshop 22 Version
10.2) Accelerometer
PCB Accelerometer
Model: 393B05
Measurement setup
F Span: 200 Hz
Lines: 3200
Averaging: Spectrum Averaging
Engineering Units: m/s
Window: Hanning
Overlap: Max
Conclusion
All axes met the VC criteria in the field report, and a ZEISS engineer confirmed the customer equipment operates normally for X-ray imaging.
Reference
Generic Vibration Criteria
Notes:
- As measured in one-third octave bands over 8-80 Hz (VC-A/B) or 1-80 Hz (VC-C through VC-G).
- Detail size refers to width in microelectronics fabrication or particle size in medical research.
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