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Installation Report
DVIA-P Series
12-12-2023

Tier-1 Semiconductor Advanced Institute EVG 6200 Aligner DVIA-P2200 Inspection Report

DVIA-P Series
Inspection Report
Tier-1 Semiconductor Advanced Institute
EVG
6200
140416R6-6

Overview

Operation status inspection and vibration measurement of the DVIA-P2200.

Inspection and vibration measurement were performed with the equipment in IDLE state. (Equipment vibration typically occurs in the 10–30 Hz band.)

The pad X-axis face contacts the grating, which degrades performance in the 5–10 Hz band.

Z and Y axes show correct operation when reviewed with the DAEIL SYSTEMS program Transmissibility graph.

Vibration Isolation System Information

Model: DVIA-P2200

Serial Number: 140416R6-6

Serial Number (SAC-07): 022604

Engineer

Youngha Lee, Jongwon Park from DAEIL SYSTEMS

Inspection Date

December 12, 2023

Installation Site

SAIT Cleanroom Building A, Suwon

Equipment

Aligner EVG 6200

Summary of Vibration Results

Measurement PointZ-axis (Vertical) 1–10 HzZ-axis (Vertical) 12.5–80 HzX-axis (Left to Right) 1–10 HzX-axis (Left to Right) 12.5–80 HzY-axis (Front to Back) 1–10 HzY-axis (Front to Back) 12.5–80 Hz
FloorDAFAB
Operating Theatre (ISO) ActiveDBDCCA

Inspection was performed with the upper equipment in IDLE state.

When equipment is IDLE, vibration often appears in the 10–30 Hz band or higher; such vibration may be measured on the top plate.

Due to pad contact with the grating, top-plate vibration in the X-axis low-frequency band was measured larger than the bottom plate.

For accurate isolator inspection and tuning, the upper equipment should be fully turned off.

Measuring Equipment

8.1) PULSE 22

Hardware: Bruel & Kjaer Type 3050-A-040

Software: LapShop Application (PULSE Lapshop)

8.2) Accelerometer

PCB Accelerometer

Model: 393B05

Data and Image

Installation Site

Accelerometer Sensor

Accelerometer and displacement sensors sense vibration changes correctly and operate normally.

Displacement Sensor

Z-axis (Vertical) Passive Transmissibility

The DVIA-P resonance peak in the passive transmissibility graph is correctly below 10 Hz.

Multiple resonance peaks above 12 Hz, 16 Hz, and 20 Hz are attributed to equipment IDLE vibration.

In the active transmissibility graph, transmissibility near 0 dB in the 2–7 Hz band indicates reduced performance without amplification; multiple resonance peaks above 16 Hz and 20 Hz are attributed to equipment IDLE vibration.

In other bands, transmissibility is −10 dB or lower, indicating proper isolation.

Z-axis (Vertical) Feedforward Transmissibility, FFT Vibration (Floor, Active)

X-axis (Left to Right) Passive Transmissibility

The DVIA-P resonance peak in the passive transmissibility graph is near 10 Hz.

The asymmetric transmissibility shape suggests utility structure or equipment influence; the peak near 26 Hz is attributed to equipment IDLE vibration.

In the active transmissibility graph, transmissibility near 0 dB between 10–20 Hz suggests the structure may be constrained by utility or other coupling; the peak near 26 Hz is attributed to equipment IDLE vibration.

In other bands, transmissibility is −10 dB or lower, indicating proper isolation.

X-axis (Left to Right) Transmissibility, FFT Vibration (Floor, Active)

Y-axis (Front to Back) Passive Transmissibility

The DVIA-P resonance peak in the passive transmissibility graph is near 10 Hz.

The blunt transmissibility shape below 10 dB suggests utility structure or equipment influence; the peak near 37 Hz is attributed to equipment IDLE vibration.

In the active transmissibility graph, transmissibility below −10 dB near 10 Hz suggests possible utility or structural coupling; the peak near 37 Hz is attributed to equipment IDLE vibration.

In other bands, transmissibility is −10 dB or lower, indicating proper isolation.

Y-axis (Front to Back) Transmissibility, FFT Vibration (Floor, Active)

Z-axis (Vertical) VC curves

In the low-frequency band, vibration is at or below VC-F; proportional response yields lower attenuation.

Between 10–50 Hz, top-plate vibration exceeds the bottom plate; compared with the DAEIL UI program transmissibility graph, this is attributed to upper equipment IDLE vibration.

Z-axis (Vertical) VC curves (21.12.15 measurement)

X-axis (Left to Right) VC curves

In the low-frequency band, vibration is at or below VC-F; proportional response yields lower attenuation.

Between 5–10 Hz, top-plate vibration exceeds the bottom plate; because other axes isolate normally, X-axis installation structure or upper equipment IDLE vibration is suspected (grating contact issue).

Comparison before/after removing the grating with the upper equipment turned off, plus tuning, is required.

X-axis (Left to Right) VC curves (21.12.15 measurement)

Y-axis (Front to Back) VC curves

In the 1–4 Hz low-frequency band, vibration is at or below VC-G; proportional response yields lower attenuation.

Between 30–50 Hz, upper equipment IDLE vibration inverts or reduces top-plate vibration relative to the bottom plate.

Y-axis (Front to Back) VC curves (21.12.15 measurement)

Grating contact issue

The pad X-axis face contacts the grating while equipment is installed, affecting X-axis isolation performance; structural review is required.

Reference

Criterion CurveDescriptionAmplitude
μm/s (µin/s)
Detail Size
μm
Workshop (ISO)Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.800 (32,000)N/A
Office (ISO)Perceptible vibration. Appropriate to offices and non-sensitive areas.400 (16,000)N/A
Residential Area (ISO)Barely perceptible vibration. Suitable for sleeping areas in most cases.200 (8,000)75
Operating Theatre (ISO)Imperceptible vibration. Suitable for operating theatres and 100× microscopes.100 (4,000)25
VC-ASuitable for 400× optical microscopes, microbalances, and optical balances.50 (2,000)8
VC-BSuitable for 3 µm linewidth inspection and lithography equipment.25 (1,000)3
VC-CSuitable for 1000× optical microscopes and 1 µm lithography equipment.12.5 (500)1 - 3
VC-DSuitable for demanding equipment such as electron microscopes (SEM/TEM).6.25 (250)0.1 - 0.3
VC-EFor the most demanding systems such as nanometre-scale E-beam lithography.3.12 (125)< 0.1
VC-FFor extremely quiet research spaces; not recommended as a design criterion.1.56 (62.5)N/A
VC-GFor extremely quiet research spaces; not recommended as a design criterion.0.78 (31.25)N/A

Notes:

- VC-A/B are measured in 1/3-octave bands over 8–80 Hz; VC-C through VC-G over 1–80 Hz.

- Detail size refers to linewidth in microelectronics manufacturing or particle size in medical research.

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Case Study Information

Category
Installation Report
SeriesDVIA-P Series
Date12-12-2023
Tags
DVIA-P Series
Inspection Report
Tier-1 Semiconductor Advanced Institute
EVG
6200
140416R6-6