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Installation Report
DVIA-P Series
05-21-2026

Tier-1 Semiconductor Advanced Institute Aligner MA-200C DVIA-P2200 Inspection Report

DVIA-P Series
Inspection Report
Tier-1 Semiconductor Advanced Institute
Aligner
MA-200C
DVIA-P2200

Overview

Operation status inspection and vibration measurement were performed on the DVIA-P2200.

Inspection and vibration measurement were conducted with the equipment in IDLE state (typically 10–30 Hz equipment vibration).

Measurement results are uncertain due to equipment IDLE vibration, but Transmissibility graphs from the Daeil Systems program indicate correct operation.

System Information

Model: DVIA-P2200

Serial Number: 140416R6-5

Serial Number (SAC-07): 022470

Engineer

Youngha Lee, Jongwon Park from DAEIL SYSTEMS

Inspection Date

December 12, 2023

Location

Tier-1 Semiconductor Advanced Institute Cleanroom Building A, Suwon

Equipment

Aligner MA-200C

Summary of Vibration Results

Measurement PointZ-axis (Vertical) 1-10 HzZ-axis (Vertical) 12.5-80 HzX-axis (Left to Right) 1-10 HzX-axis (Left to Right) 12.5-80 HzY-axis (Front to Back) 1-10 HzY-axis (Front to Back) 12.5-80 Hz
FloorFADA+DA
ActiveDCDCCC

Inspection was performed with the upper equipment in IDLE state.

When the equipment is in IDLE state, equipment vibration typically occurs in the 10–30 Hz band or high-frequency bands, and such vibration may be measured on the top plate.

For accurate inspection and tuning of the vibration isolation system, the upper equipment must be completely turned off.

Vibration Measurement

8.1) PULSE 22

Hardware: Bruel & Kjaer Type 3050-A-040

Software: LapShop Application(PULSE Lapshop)

8.2) Accelerometer

PCB Accelerometer

Model: 393B05

Data and Image

Accelerometer Sensor

Displacement Sensor

Z-axis (Vertical) Passive Transmissibility

Z-axis (Vertical) Feedforward Transmissibility, FFT Vibration (Floor, Active)

Passive Transmissibility graph shows the DVIA-P resonance peak correctly below 10 Hz.

The Active Transmissibility graph shows resonance peaks with Transmissibility at or above 0 dB near 22 Hz and 60 Hz, suspected to be equipment IDLE vibration.

In all other bands, isolation operates correctly at −10 dB or better.

X-axis (Left to Right) Passive Transmissibility

X-axis (Left to Right) Transmissibility, FFT Vibration (Floor, Active)

Passive Transmissibility graph shows the DVIA-P resonance peak correctly below 10 Hz, but the graph shape is not clean, suggesting utility influence or equipment IDLE vibration.

The Active Transmissibility graph shows Transmissibility at or above 0 dB near 2.5 Hz because vibration is very low, below −80 dB.

Resonance peaks with Transmissibility at or above 0 dB appear near 10–20 Hz, suspected to be equipment IDLE vibration.

In all other bands, isolation operates correctly at −10 dB or better.

Y-axis (Front to Back) Passive Transmissibility

Y-axis (Front to Back) Transmissibility, FFT Vibration (Floor, Active)

Passive Transmissibility graph shows the DVIA-P resonance peak correctly below 10 Hz, but the graph shape is not clean, suggesting utility influence or equipment IDLE vibration.

The Active Transmissibility graph shows Transmissibility at or above 0 dB near 2.5 Hz because vibration is very low, below −80 dB.

Resonance peaks with Transmissibility at or above 0 dB appear near 20 Hz, suspected to be equipment IDLE vibration.

In all other bands, isolation operates correctly at −10 dB or better.

Z-axis (Vertical) VC curves

In the 1–8 Hz band, vibration is below VC-G and low damping is output due to proportional vibration characteristics.

In the 8–40 Hz band, the top plate measured higher vibration than the floor due to equipment vibration influence.

The Z-axis Transmissibility graph from the Daeil UI Program appears normal output, suspected to be equipment IDLE vibration.

Z-axis (Vertical) VC curves (21.12.15 measurement)

X-axis (Left to Right) VC curves

In the 1–3 Hz band, vibration is below VC-G and low damping is output due to proportional vibration characteristics.

In the 6–15 Hz band, the top plate measured higher vibration than the floor due to equipment vibration influence, suspected to be equipment IDLE vibration or utility influence.

X-axis (Left to Right) VC curves (21.12.15 measurement)

Y-axis (Front to Back) VC curves

In the 1–3 Hz band, vibration is below VC-G and low damping is output due to proportional vibration characteristics.

In the 7–10 Hz band, the top plate measured higher vibration than the floor due to equipment vibration influence, suspected to be equipment IDLE vibration or utility influence.

Y-axis (Front to Back) VC curves (21.12.15 measurement)

Reference

Generic Vibration Criteria

Criterion CurveDescriptionAmplitude
μm/s (µin/s)
Detail Size
μm
Workshop (ISO)Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.800 (32,000)N/A
Office (ISO)Perceptible vibration. Appropriate to offices and non-sensitive areas.400 (16,000)N/A
Residential Area (ISO)Barely perceptible vibration. Appropriate to sleep areas in most instances.200 (8,000)75
Operating Theatre (ISO)Vibration not perceptible. Suitable for surgical suites, microscopes to 100x.100 (4,000)25
VC-AAdequate for optical microscopes to 400x, microbalances, optical balances.50 (2,000)8
VC-BAppropriate for inspection and lithography equipment to 3μm line widths.25 (1,000)3
VC-CAppropriate for optical microscopes to 1000x, lithography equipment to 1μm.12.5 (500)1 - 3
VC-DSuitable for demanding equipment including electron microscopes (SEMs/TEMs).6.25 (250)0.1 - 0.3
VC-EFor the most demanding systems including E-Beam lithography at nanometer scales.3.12 (125)< 0.1
VC-FFor extremely quiet research spaces. Not recommended as design criterion.1.56 (62.5)N/A
VC-GFor extremely quiet research spaces. Not recommended as design criterion.0.78 (31.25)N/A

Notes:

1. VC-A/B is measured in 1/3 octave bands from 8-80 Hz, VC-C through VC-G from 1-80 Hz.

2. Detail size refers to line widths in microelectronics manufacturing or particle sizes in medical research.

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Case Study Information

Category
Installation Report
SeriesDVIA-P Series
Date05-21-2026
Tags
DVIA-P Series
Inspection Report
Tier-1 Semiconductor Advanced Institute
Aligner
MA-200C
DVIA-P2200