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Installation Report
DVIA-P Series
12-10-2025

Tier-1 Semiconductor Fabrication Facility Hwaseong ZEISS AIMS32-193i DVIA-P4000 Installation Report

DVIA-P Series
Installation Report
Tier-1 Semiconductor Fabrication Facility
ZEISS
AIMS32-193i

Overview

Tuning and vibration measurement were performed on the DVIA-P4000 installed at Tier-1 Semiconductor Fabrication Facility Hwaseong NRD Line.

Tuning and vibration measurement were conducted with the equipment installed / IDLE.

On November 10, 2025 during inspection, part of the access floor around the isolator was in contact with the isolator. Such structural interference is a factor that directly and strongly affects isolator performance.

A booth structure was connected adjacent to the equipment installed on the isolator, and strong vibration from that booth was observed continuously. Such vibration may affect isolator performance and vibration measurement results.

Before and after inspection data were compared.

Data are presented as VC curves with reference materials for vibration level assessment.

Vibration Isolation System Information

Model: DVIA-P4000

Serial Number: 016147

Engineer

Chaewon Lee from DAEIL SYSTEMS

Measurement Date

December 8, 2025

Installation Site

Tier-1 Semiconductor Fabrication Facility Hwaseong NRD Line

End User

Tier-1 Semiconductor Fabrication Facility

Equipment Information

Manufacturer: ZEISS

Equipment: Photomask Qualification

Model: AIMS32-193i

Equipment Specifications

VC-C

Equipment Status

Equipment installed / IDLE

Measuring Equipment

Data Physics DAQ

Hardware: QUATTRO, Serial Number: 22436

Software: SignalCalc ACE

Accelerometer

PCB Accelerometer

Model: 393B05

Measuring Set-up

F Span: 200 Hz

Lines: 3200

Engineering Units: m/s

Window: Hanning

Averaging: FFT Spectrum Averaging

Averaging mode: Exponential, 40

Conclusion

At the initial inspection, part of the access floor was in contact with the isolator; in this condition, measurements were SPEC Out in all directions.

After isolator tuning, measurement results satisfy the SPEC in all directions.

Measurement Data

Measuring PointStatusDirectionSpecMeasurement (before tuning)Measurement (after tuning)Result (before tuning)Result (after tuning)
Tier-1 Semiconductor Fabrication Facility Hwaseong NRD Line
1. Before tuning
2. After tuning
Equipment installed / IDLEVerticalVC-CVC-B
@ 12.5 Hz
VC-C
@ 12.5 Hz
FAILPASS
Left to RightVC-B
@ 12.5 Hz
VC-C
@ 12.5 Hz
FAILPASS
Front to BackVC-A
@ 12.5 Hz
VC-C
@ 12.5 Hz
FAILPASS

Data and Image

Vertical VC Curves

Vertical Autospectrum

Left to Right VC Curves

Left to Right Autospectrum

Front to Back VC Curves

Front to Back Autospectrum

Reference

Generic Vibration Criteria

Criterion CurveDescriptionAmplitude
μm/s (µin/s)
Detail Size
μm
Workshop (ISO)Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.800 (32,000)N/A
Office (ISO)Perceptible vibration. Appropriate to offices and non-sensitive areas.400 (16,000)N/A
Residential Area (ISO)Barely perceptible vibration. Appropriate to sleep areas in most instances.200 (8,000)75
Operating Theatre (ISO)Vibration not perceptible. Suitable for surgical suites, microscopes to 100x.100 (4,000)25
VC-AAdequate for optical microscopes to 400x, microbalances, optical balances.50 (2,000)8
VC-BAppropriate for inspection and lithography equipment to 3μm line widths.25 (1,000)3
VC-CAppropriate for optical microscopes to 1000x, lithography equipment to 1μm.12.5 (500)1 - 3
VC-DSuitable for demanding equipment including electron microscopes (SEMs/TEMs).6.25 (250)0.1 - 0.3
VC-EFor the most demanding systems including E-Beam lithography at nanometer scales.3.12 (125)< 0.1
VC-FFor extremely quiet research spaces. Not recommended as design criterion.1.56 (62.5)N/A
VC-GFor extremely quiet research spaces. Not recommended as design criterion.0.78 (31.25)N/A

Notes:

1. VC-A/B is measured in 1/3 octave bands from 8-80 Hz, VC-C through VC-G from 1-80 Hz.

2. Detail size refers to line widths in microelectronics manufacturing or particle sizes in medical research.

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Case Study Information

Category
Installation Report
SeriesDVIA-P Series
Date12-10-2025
Tags
DVIA-P Series
Installation Report
Tier-1 Semiconductor Fabrication Facility
ZEISS
AIMS32-193i