Installation Report
DVIA-M Series
09-09-2024
ZEISS Crossbeam350 FIB-SEM DVIA-M1000 (231128R3) — Tier-1 Semiconductor installation worksheet
DVIA-M Series
Installation Report
Tier-1 Semiconductor
ZEISS
Crossbeam350
FIB-SEM
DVIA-M1000
DVIA-ML1000
231128R3
Contents
Tier-1 Semiconductor
Tier-1 Semiconductor
(M1000_ 231128R3 Set-up)
Site checklist
| Target equipment | ZEISS Crossbeam350 |
|---|---|
| Place of installation | N/A |
| Remark | Good Performance |
| END USER | N/A |
Operator and dates
Operator: Chaewon Lee
Date of setup: 24.08.28
Date of reporting: 24.09.09
Date of business trip : 17.12.27~17.12.29
Overview
The DVIA-M1000 active vibration isolation platform is appropriately installed and functioning as intended.
Measurement date: 2024.08.28(Wednesday)
Operator: Chaewon Lee from DAEIL SYSTEMS
Place of measurement: N/A
Equipment Model: N/A
Manufacturer: ZEISS
Equipment: FIB-SEM
Model: Crossbeam350
5.
M1000 internal program performance measurement result
Vertical
Left to Right
Front to Back
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Case Study Information
Category
Installation Report
SeriesDVIA-M Series
Date09-09-2024
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
ZEISS
Crossbeam350
FIB-SEM
DVIA-M1000
DVIA-ML1000
231128R3
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