Installation Report
DVIA-M Series
02-04-2024
Tier-1 Semiconductor DVIA-M-THT3 (230818R1-2) internal program worksheet — setup 2024.02.04
DVIA-M Series
Installation Report
Tier-1 Semiconductor
DVIA-M-THT3
230818R1-2
Contents
Worksheet
M-THT3_ 230818R1-2 Set-up
Target equipment: N/A
Place of installation: N/A
Remark: Good Performance
END USER: N/A
Operator · setup · reporting
Operator: Chaewon Lee Date of setup: 24.02.04 Date of reporting: 24.07.05
Date of business trip
17.12.27~17.12.29
Overview
The DVIA-M-THT3 active vibration isolation platform is appropriately installed and functioning as intended.
Measurement date
2024.02.04(Sunday)
Operator
Chaewon Lee from DAEIL SYSTEMS
Place of measurement
N/A
Equipment Model
N/A
M-THT3 internal program performance measurement result
Vertical
Left to Right
Front to Back
Share this Case Study
Case Study Information
Category
Installation Report
SeriesDVIA-M Series
Date02-04-2024
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
DVIA-M-THT3
230818R1-2
Related Case Studies
DVIA-M Series
Tier-1 Semiconductor DVIA-MB3000 (230818R1-2) Installation Worksheet — setup 2024.02.01
02-01-2024Read more
DVIA-M Series
Tier-1 Semiconductor Hwaseong ZEISS GeminiSEM 460 DVIA-MB1000 (230110R2) Installation Report
05-15-2026Read more
DVIA-M Series
Tier-1 Semiconductor DSR ZEISS GeminiSEM 460 DVIA-MB1000 (231123R6) Installation Report
05-15-2026Read more