Samsung Electro Busan FCB PSP DVIA-P2200 (230417R6) Installation Report — 2024-04-17
Contents
Overview
SET-UP and vibration measurement were performed on the DVIC-P2200 relocated to the Samsung Electro Busan site.
On April 16, the DVIC-P2200 was confirmed to be supported by Level Foot. On April 17, horizontal alignment was performed with a liner, then Level Foot was released and the unit was supported on the DVIC-P2200 Frame.
Steel structures and cables connected to the PSP unit 1 Frame were checked. Tuning with the equipment in IDLE state can affect DVIC-P2200 vibration isolation performance.
After tuning was completed, measurement data were plotted on VC curve graphs.
Vibration Isolation System Information
Model: DVIC-P2200 – 1500 X 1300 X 1415H
Serial Number: 230417R6
Engineer
Jongwon Park and Chaewon Lee from DAEIL SYSTEMS
Installation Date
April 17, 2024
Installation Site
Samsung Electro Busan site, FCB building 3F
Equipment
FCB PSP unit 1
Vibration Specifications
VC-B
Equipment Status
Equipment is installed/IDLE
Tuning Date
April 17, 2024
Tuning Count
2nd visit (1st visit Suwon)
Measuring Equipment
10.1) PULSE 22
-Hardware: Bruel & Kjaer Type 3050-A-040
-Software: LapShop Application (PULSE Lapshop)
10.2) Accelerometer
- PCB Accelerometer
- Model: 393B05
Measuring Set-up
11.1) Measurement setting
Bandwidth: 0 – 200 Hz
Lines: 801
Analyzer: FFT Spectrum Averaging
Signal Units: m/s2
Spectral Units: rms
11.2) Measurement method
Accelerometers are attached to the upper stage (DVIC-P2200 stone table) and the floor.
Vibration is measured in Vertical, Left to Right, and Front to Back directions.
Conclusion
Vibration measurement results for Vertical, Left to Right, and Front to Back all show rising vibration at low frequency. This appears to be due to nearby construction: external vibration entering via steel structures connected to PSP unit 1 Frame and cables attached to that steel.
Isolation begins after 2–5 Hz for Vertical, Left to Right, and Front to Back.
Vibration rises at 63 Hz for Vertical, Left to Right, and Front to Back; this appears to be vibration from equipment IDLE state.
Revisit after construction is complete and re-tune under conditions where vibration is not transmitted directly to equipment on top of the isolator.
Equipment vibration specification is satisfied in all frequency bands.
Perfect Turn Off of PSP unit 1 is required to confirm accurate isolation performance.
Measurement Data
| Type | Position | Direction | Specification | Floor | DVIA-PB2200 | Result (Floor) | Result (DVIA-PB2200) |
|---|---|---|---|---|---|---|---|
| Vibration | FCB building 3F | Vertical | 5.07E-05 - 4.06E-05 @ 4 - 5 Hz | 6.36E-06 @ 5 Hz | 2.25E-06 @ 5 Hz | ✓ PASS | ✓ PASS |
| 4.06E-05 - 3.22E-05 @ 5 - 6.25 Hz | 7.41E-06 @ 6.25 Hz | 2.87E-06 @ 6.25 Hz | ✓ PASS | ✓ PASS | |||
| 3.22E-05 - 2.5E-05 @ 6.25- 8 Hz | 3.14E-06 @ 8 Hz | 2.44E-06 @ 8 Hz | ✓ PASS | ✓ PASS | |||
| 2.5E-05 @ 8 - 80 Hz | 4.82E-06 @ 12.5 Hz | 1.93E-06 @ 12.5 Hz | ✓ PASS | ✓ PASS | |||
| Left to Right | 5.07E-05 - 4.06E-05 @ 4 - 5 Hz | 4.91E-06 @ 5 Hz | 2.86E-06 @ 5 Hz | ✓ PASS | ✓ PASS | ||
| 4.06E-05 - 3.22E-05 @ 5 - 6.25 Hz | 4.43E-06 @ 6.25 Hz | 2.17E-06 @ 6.25 Hz | ✓ PASS | ✓ PASS | |||
| 3.22E-05 - 2.5E-05 @ 6.25- 8 Hz | 2.94E-06 @ 8 Hz | 2.05E-06 @ 8 Hz | ✓ PASS | ✓ PASS | |||
| 2.5E-05 @ 8 - 80 Hz | 2.90E-06 @ 20 Hz | 5.48E-07 @ 20 Hz | ✓ PASS | ✓ PASS | |||
| Front to Back | 5.07E-05 - 4.06E-05 @ 4 - 5 Hz | 2.81E-06 @ 4 Hz | 3.45E-06 @ 4 Hz | ✓ PASS | ✓ PASS | ||
| 4.06E-05 - 3.22E-05 @ 5 - 6.25 Hz | 2.20E-06 @ 5 Hz | 3.31E-06 @ 5 Hz | ✓ PASS | ✓ PASS | |||
| 3.22E-05 - 2.5E-05 @ 6.25- 8 Hz | 2.97E-06 @ 6.25 Hz | 2.02E-06 @ 6.25 Hz | ✓ PASS | ✓ PASS | |||
| 2.5E-05 @ 8 - 80 Hz | 2.47E-06 @ 10 Hz | 1.07E-06 @ 10 Hz | ✓ PASS | ✓ PASS |
Data and Image
Vertical VC Curves
Vertical Transmissibility
Left to Right VC Curves
Left to Right Transmissibility
Front to Back VC Curves
Front to Back Transmissibility
Reference
Generic Vibration Criteria
Notes:
- As measured in one-third octave bands over 8-80 Hz (VC-A/B) or 1-80 Hz (VC-C through VC-G).
- Detail size refers to width in microelectronics fabrication or particle size in medical research.
