WONIK IPS DVIA-T78 (211213R1) Installation Report
Contents
Engineer
Engineer: Donggyu Park
Tuning Date
November 25, 2025
Report Written Date
November 27, 2025
Overview
Tuning and vibration measurement were conducted on the T78 installed in the 4F wafer analysis lab at the WONIK IPS Jinwi site.
Tuning and vibration measurement were conducted with the equipment installed and in a Turned on/IDLE state.
Floor vibration versus the DVIA-T78 isolator plate was measured once, and vibration on the instrument floor over the DVIA-T78 was measured once, for a total of two vibration measurement rounds.
Data are presented as VC curves, and Reference materials are provided for the vibration levels.
Vibration Isolation Platform
Model: DVIA-T78
Serial number: 211213R1
Field Engineer
Park Dong-gyu from the DAEIL SYSTEMS Development Team
Installation Site
WONIK IPS Jinwi site, 4F wafer analysis lab
End User
WONIK IPS
Customer Equipment
Manufacturer: BRUKER
Equipment: Nano Indentation tester
Model: TS77
Equipment Specification
VC-C
Equipment Status
Equipment installation and Turned on/IDLE
Measuring Equipment
10.1) Brüel & Kjær LAN-XI DAQ Type 3050 DAQ
-Hardware: B&K Front End Type 3050-A-040
-Software: B&K Pulse Labshop 22 Version
10.2) Accelerometer
PCB Accelerometer
Model: 393B05
Vibration Measurement Setup
Bandwidth: 200 Hz
Lines: 3200
Averaging: Spectrum Averaging
Engineering Units: m/s
Window: Hanning
Overlap: Max
Conclusion
The DVIA-T78 meets the vibration specification in all directions.
Aside from Vertical-axis floor vibration, which exceeds the vibration specification band, floor vibration satisfies the vibration specification in all directions.
Equipment-floor vibration satisfies the vibration specification in all directions.
Measurement Data
13.1) Measurement dataset 1
| Place of Measurement | Status | Direction | Floor vibration | On DVIA-T78 | Floor (result) | On DVIA-T78 (result) |
|---|---|---|---|---|---|---|
| WONIK IPS Jinwi site, 4F wafer analysis lab 1. Floor vibration 2. DVIA-T78 | Turned on/IDLE | Vertical | VC-B @ 6 Hz | VC-E @ 70 Hz | ✗ Fail | ✓ Pass |
| Left to Right | VC-D @ 3 Hz | VC-G @ 1 Hz | ✓ Pass | ✓ Pass | ||
| Front to Back | VC-D @ 3 Hz | VC-G @ 70 Hz | ✓ Pass | ✓ Pass |
13.2) Measurement dataset 2
| Place of Measurement | Status | Direction | Measurement value |
|---|---|---|---|
| Instrument floor vibration | |||
| WONIK IPS Jinwi site, 4F wafer analysis lab 1. Instrument floor vibration | Turned on/IDLE | Vertical | VC-F @ 2 Hz |
| Left to Right | VC-F @ 10 Hz | ||
| Front to Back | VC-E @ 10 Hz |
Data and Image
14.1) Measurement dataset 1
Vertical VC Curves (Red: Floor vibration; Blue: DVIA-T78)
Vertical Autospectrum (Red: Floor vibration; Blue: DVIA-T78)
Vertical Transmissibility (Red: Floor vibration; Blue: DVIA-T78)
Left to Right VC Curves (Red: Floor vibration; Blue: DVIA-T78)
Left to Right Autospectrum (Red: Floor vibration; Blue: DVIA-T78)
Left to Right Transmissibility (Red: Floor vibration; Blue: DVIA-T78)
Front to Back VC Curves (Red: Floor vibration; Blue: DVIA-T78)
Front to Back Autospecturm (Red: Floor vibration; Blue: DVIA-T78)
Front to Back Transmissibility (Red: Floor vibration; Blue: DVIA-T78)
14.2) Measurement dataset 2
Vertical VC Curves (Red: Instrument floor vibration)
Vertical Autospectrum (Red: Instrument floor vibration)
Left to Right VC Curves (Red: Instrument floor vibration)
Left to Right Autospectrum (Red: Instrument floor vibration)
Front to Back VC Curves (Red: Instrument floor vibration)
Front to Back Autospecturm (Red: Instrument floor vibration)
Reference
Notes:
1. VC-A/B is measured in 1/3 octave bands from 8-80 Hz, VC-C through VC-G from 1-80 Hz.
2. Detail size refers to line widths in microelectronics manufacturing or particle sizes in medical research.
