Tier-1 Semiconductor Giheung Bruker AFM NM-VI6 DVIA-P4000 Installation Report (VOC26-132)
Contents
Report Information
Report: DVIA-P4000 Installation Report, S/N 200805R3 (VOC 26-132, POS alarm)
Author: Sungyoon Jung, Gyumin Park · DAEIL SYSTEMS
Installation date: 2026-07-21
Report written date: 2026-08-03
Overview
Tuning and vibration measurement were performed after the DVIA-P4000 was installed on the 3rd floor of the V1 line at the Tier-1 Semiconductor Giheung site.
The inspection and vibration measurement were performed with the equipment in the IDLE state.
The data are presented as VC Curves, together with reference material on vibration levels.
Vibration Isolation System
Model: DVIA-P4000
Serial Number: 200805R3
Engineer
Sungyoon Jung, Gyumin Park · DAEIL SYSTEMS
Tuning Date
2026-07-21
Installation Site
SR1 Building, V Line 3F
End User
Tier-1 Semiconductor
Customer Equipment
Manufacturer: Bruker
Equipment: AFM
Model: NM-VI6
Vibration Specifications
| Axis | Frequency [Hz] | Specification [µm/s RMS] |
|---|---|---|
| Horizontal | 1 | 6.25 |
| 100 | 6.25 | |
| Vertical | 1 | 6.25 |
| 100 | 6.25 |
Equipment Status
IDLE
Measuring Equipment
Measurement Equipment
- Hardware: B&K Front End Type 3040-A-040
- Software: B&K Pulse Labshop22 Version
Accelerometer
- PCB 393B05
Measuring Set-up
F Span: 200 Hz
Lines: 2400
Engineering Units: m/s
Window: Hanning
Averaging: FFT Spectrum Averaging
Conclusion
This site inspection and re-tuning were carried out to resolve the recurring POS alarm issue on the isolator beneath the Bruker NM-VI6 installed at the Mask Development Team of the Tier-1 Semiconductor Giheung site, and to optimise its control performance. Despite an imperfect measurement environment caused by some on-site constraints and by the real-time operating condition of the payload (IDLE state), the corrective work satisfied the VC-D vibration specification of the payload and secured basic vibration control stability. This re-tuning focused in particular on improving the lack of margin under the payload loading condition; as a result, vibration risks that could arise during future process operation were resolved in advance and a stable operating environment for the equipment was established.
Measurement Data Summary
| Measurement Point | Vibration Specification | Axis | Result | |
|---|---|---|---|---|
| Floor | DVIA-P4000 | |||
| 1. Floor 2. DVIA-P4000 | Refer to Vibration Specifications | Vertical (Z-axis) | ✗ FAIL | ✓ PASS |
| Left to Right (X-axis) | ✓ PASS | ✓ PASS | ||
| Front to Back (Y-axis) | ✓ PASS | ✓ PASS | ||
Measurement Data
Vertical (Z-axis) VC Curves
Left to Right (X-axis) VC Curves
Front to Back (Y-axis) VC Curves
Reference
The table below is the vibration level classification of IEST-RP-CC012.2.
Notes:
1. Measured in 1/3 octave bands over 8-80 Hz (VC-A and VC-B) or 1-80 Hz (VC-C through VC-G).
2. Detail size refers to line width in microelectronics manufacturing, or particle (cell) size in medical and pharmaceutical research; it corresponds to imaging related to probe technology, AFM and nanotechnology.
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