설치 보고서
DVIA-M Series
09-09-2024
ZEISS Crossbeam350 FIB-SEM DVIA-M1000 (231128R3) — Tier-1 Semiconductor installation worksheet
DVIA-M Series
Installation Report
Tier-1 Semiconductor
ZEISS
Crossbeam350
FIB-SEM
DVIA-M1000
DVIA-ML1000
231128R3
목차
Tier-1 Semiconductor
Tier-1 Semiconductor
(M1000_ 231128R3 Set-up)
현장 확인 항목
| Target equipment | ZEISS Crossbeam350 |
|---|---|
| Place of installation | N/A |
| Remark | Good Performance |
| END USER | N/A |
운영자 및 일정
Operator: Chaewon Lee
Date of setup: 24.08.28
Date of reporting: 24.09.09
Date of business trip : 17.12.27~17.12.29
개요
The DVIA-M1000 active vibration isolation platform is appropriately installed and functioning as intended.
Measurement date: 2024.08.28(Wednesday)
Operator: Chaewon Lee from DAEIL SYSTEMS
Place of measurement: N/A
Equipment Model: N/A
Manufacturer: ZEISS
Equipment: FIB-SEM
Model: Crossbeam350
5.
M1000 내부 프로그램 성능 측정 결과
Vertical
Left to Right
Front to Back
이 케이스 스터디 공유하기
케이스 스터디 정보
카테고리
설치 보고서
시리즈DVIA-M Series
작성일09-09-2024
태그
DVIA-M Series
Installation Report
Tier-1 Semiconductor
ZEISS
Crossbeam350
FIB-SEM
DVIA-M1000
DVIA-ML1000
231128R3
관련 케이스 스터디
DVIA-M Series
Tier-1 Semiconductor Onyang ZEISS Crossbeam 550 FIB-SEM DVIA-M1000 (240726R3) Installation Report
02-24-2025자세히

DVIA-M Series
YIMO BYD Semiconductor ZEISS Crossbeam 550 FIB-SEM DVIA-M1000 (240314R6) Installation Report
05-11-2026자세히

DVIA-M Series
Shenghe Jingwei ZEISS Crossbeam 350 FIB-SEM DVIA-M1000 (240409R2) Installation Report
05-11-2026자세히