설치 보고서
DVIA-M Series
06-29-2021
YIMO Nexchip ZEISS Crossbeam 550 DVIA-MB1000 (MB1000 P212 · 210204R3) Internal Program — 2021.06.29
DVIA-M Series
Installation Report
YIMO
Nexchip
Hefei
ZEISS Crossbeam 550
DVIA-MB1000
MB1000
P212
210204R3
목차
MB1000 P212 210204R3
설치 사진
| Target equipment | ZEISS-CROSSBEAM 550 |
|---|---|
| Place of installation | hefei |
| Remark | Good Performance |
| END USER | Nexchip |
| Operator: Choi, HyoungMun | Date of business trip : 17.12.27~17.12.29 |
| Date of setup : 21.06.28 | |
| Date of reporting : 21.06.29 |
개요
After Active mounting, measure the vibration environment to check that there is no problem in using the equipment.
Measurement date: 21.06.28 (MON)
Operator: Daeil System, Research engineer Choi, HyoungMun
Place of measurement : hefei
Equipment Model: ZEISS-CROSSBEAM 550
측정 조건 및 결과
측정 결과 요약
| 축 | Transmissibility (2 Hz) | Transmissibility (5 Hz) | Transmissibility (10 Hz) |
|---|---|---|---|
| Z | -23 dB | -37 dB | -37 dB |
| X | -33 dB | -30 dB | -30 dB |
| Y | -27 dB | -34 dB | -40 dB |
Good omnidirectional performance.
MB1000 internal program performance measurement result
Z축
X축
Y축
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설치 보고서
시리즈DVIA-M Series
작성일06-29-2021
태그
DVIA-M Series
Installation Report
YIMO
Nexchip
Hefei
ZEISS Crossbeam 550
DVIA-MB1000
MB1000
P212
210204R3
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