Installation Report
DVIA-M Series
03-06-2023
Tier-1 Semiconductor ZEISS Crossbeam 350 DVIA-M1000 (221212R2) Installation Report — Shanghai — 2023.03.06
DVIA-M Series
Installation Report
Tier-1 Semiconductor
ZEISS
Crossbeam 350
Shanghai
DVIA-M1000
221212R2
Contents
(M1000_ 221212R2 Set up)
Equipment photo
| Target equipment | Zeiss crossbeam 350 |
|---|---|
| Place of installation | SHANGHAI |
| Remark | Good Performance |
| END USER | Tier-1 Semiconductor |
| Operator: Lee, Young Ha | Date of business trip : 17.12.27~17.12.29 |
| Date of setup: 23.03.06 | |
| Date of reporting: 23.03.13 |
Overview
The DVIA-M1000 active vibration isolation platform is appropriately installed and functioning as intended.
Measurement date
2023.03.06 (Monday),
Operator
Operator: DAEIL SYSTEMS, Youngha Lee
Place of measurement
SHANGHAI
Equipment Model
Zeiss crossbeam 350
MB1000 internal program performance measurement result
Z axis
X axis
Y axis
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Case Study Information
Category
Installation Report
SeriesDVIA-M Series
Date03-06-2023
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
ZEISS
Crossbeam 350
Shanghai
DVIA-M1000
221212R2
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