Tier-1 Semiconductor ZEISS Crossbeam 550 DVIA-MB1000 (210607R3 P231) Installation Worksheet — 2021.06.16
Contents
Target equipment
Zeiss Crossbeam 550
Place of installation
Icheon, Tier-1 Semiconductor P&T Building 1
Remark
Good Performance
End user
Tier-1 Semiconductor
Operator
Kim, DooHyun
Date of setup
21.06.16
Date of reporting
21.06.17
Date of business trip
17.12.27~17.12.29
Vibration isolation system information
Model: DVIA-MB1000
Serial number: 210607R3 (P231)
Overview
After Active mounting, measure the vibration environment to check that there is no problem in using the equipment.
Measurement date
21.06.16 (WED)
Operator: Daeil System, Research engineer Kim, Doohyun
Place of measurement
Icheon, Tier-1 Semiconductor P&T Building 1
Equipment Model
Zeiss Crossbeam 550
Measurement conditions and results
DAQ System : B&K PULSE 14 & LAN-XI Type 3056
Accelerometer : PCB PIEZOTRONICS 393B05
Frequency Range : 0.7 ~ 200Hz
Measurement conditions and results - Figure 1
Measurement conditions and results - Figure 2
Measurement conditions and results - Figure 3
Summary of measurement results
| Test Condition | VC-Class Z | VC-Class X | VC-Class Y |
|---|---|---|---|
| Floor | D | F | E |
| Above Active | E | G | E |
Good omnidirectional performance.
Measurement summary - Visualization 1
Measurement summary - Visualization 2
Vibration criterion curve
Criterion curve - Z axis
Criterion curve - X axis
Criterion curve - Y axis
Reference
Generic Vibration Criteria
Notes:
- As measured in one-third octave bands over 8-80 Hz (VC-A/B) or 1-80 Hz (VC-C through VC-G).
- Detail size refers to width in microelectronics fabrication or particle size in medical research.
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