Skip to main content
Installation Report
DVIA-M Series
06-29-2021

Nexchip Zeiss Crossbeam 550 DVIA-MB1000 (210204R3) Internal Program Performance — Hefei — 2021.06.29

DVIA-M Series
Installation Report
Nexchip
Hefei
ZEISS Crossbeam 550
DVIA-MB1000
210204R3

MB1000 P212 210204R3

Target equipmentZEISS-CROSSBEAM 550
Place of installationhefei
RemarkGood Performance
END USERNexchip
Operator: Choi, HyoungMunDate of business trip : 17.12.27~17.12.29
Date of setup : 21.06.28
Date of reporting : 21.06.29

Overview

After Active mounting, measure the vibration environment to check that there is no problem in using the equipment.

Measurement date: 21.06.28 (MON)

Operator: Daeil System, Research engineer Choi, HyoungMun

Place of measurement : hefei

Equipment Model: ZEISS-CROSSBEAM 550

Measurement conditions and results

Summary of measurement results

AxisTransmissibility (2 Hz)Transmissibility (5 Hz)Transmissibility (10 Hz)
Z-23 dB-37 dB-37 dB
X-33 dB-30 dB-30 dB
Y-27 dB-34 dB-40 dB

Good omnidirectional performance.

MB1000 internal program performance measurement result

Z axis

X axis

Y axis

Share this Case Study

Case Study Information

Category
Installation Report
SeriesDVIA-M Series
Date06-29-2021
Tags
DVIA-M Series
Installation Report
Nexchip
Hefei
ZEISS Crossbeam 550
DVIA-MB1000
210204R3