Installation Report
DVIA-M Series
06-29-2020
Tier-1 Semiconductor TESCAN-FE SEM DVIA-MB1000 (MB1000 program) Installation Report — 2020.06.29
DVIA-M Series
Installation Report
Tier-1 Semiconductor
TESCAN
FE SEM
DVIA-MB1000
MB1000
P70
Contents
(MB1000 Set up)
TESCAN — Tier-1 Semiconductor (Busan).
(MB1000_ P170)
Target equipment photo
| Target equipment | TESCAN-FE SEM |
|---|---|
| Place of installation | Tier-1 Semiconductor Busan — 4F |
| Remark | Good Performance |
| END USER | Tier-1 Semiconductor |
| Operator: Choi, Hyoung Mun | Date of business trip : 17.12.27~17.12.29 |
| Date of setup : 20.06.23 | |
| Date of reporting : 20.06.29 |
Overview
After Active mounting, measure the vibration environment to check that there is no problem in using the equipment.
Measurement date
Measurement date: 2020.06.23 (TUE)
Operator
Operator: Daeil System, Manager Choi, Hyoung Mun
Place of measurement
Place of measurement : Tier-1 Semiconductor Busan — 4F
Equipment Model
Equipment Model: TESCAN-FE SEM
Measurement conditions and results
DAQ System : B&K PULSE 14 & LAN-XI Type 3056
Accelerometer : PCB PIEZOTRONICS 393B05
Frequency Range : 0.7 ~ 200Hz
B&K LAN-XI Type 3056
PCB Piezotronics Model 393B05
B&K PULSE LabShop workspace
Summary of measurement results
| Test Condition | VC-Class Z | VC-Class X | VC-Class Y |
|---|---|---|---|
| Floor | A | D | C |
| Above Active | E | E | F |
Good omnidirectional performance.
MB1000 internal program performance measurement result
Z axis - internal program
X axis - internal program
Y axis - internal program
Octave Band Result (BASE: Floor, TOP: Above Active)
Z axis - octave band result
X axis - octave band result
Y axis - octave band result
Reference
Generic Vibration Criteria
Notes:
1. As measured in one-third octave bands over 8-80 Hz (VC-A/B) or 1-80 Hz (VC-C through VC-G).
2. Detail size refers to width in microelectronics fabrication or particle size in medical research.
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Case Study Information
Category
Installation Report
SeriesDVIA-M Series
Date06-29-2020
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
TESCAN
FE SEM
DVIA-MB1000
MB1000
P70
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