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Installation Report
DVIA-M Series
01-20-2017

Tier-1 Semiconductor TESCAN SEM (MIRA 3) DVIA-MB1000 (MB1000 P39) vibration environment measurement — 2017.01.18

DVIA-M Series
Installation Report
Tier-1 Semiconductor
DVIA-MB1000
MB1000
P39
TESCAN
MIRA3
Busan
Vibration measurement

MB1000 P39 vibration environment measurement results

(Tier-1 Semiconductor Busan campus)

Overview

제진대 설치 후 진동환경을 측정하여 장비 사용에 문제가 없는지 확인함.

Measurement facts

Measurement date: 2017-01-18 (Wed); measurer: Lim Jong-wook, DAEIL SYSTEMS

Measurement site: Tier-1 Semiconductor Busan campus

Business trip date: 2017-01-18 (Wed)

Report date: 2017-01-20 (Fri)

Field engineer: Lim Jong-wook, DAEIL SYSTEMS

Equipment model: TESCAN SEM (MIRA 3)

Measurement conditions and result summary

측정 조건: 제진대의 상판과 연구동 건물 바닥을 측정.

Test ConditionVC-Class — ZVC-Class — XVC-Class — Y
건물 바닥BDC
제진대 상판EFE

제진대가 설치된 바닥은 각각 Z축 B Class , X축 D Class, Y축 C Class로 측정됨.

제진대의 상부는 각각 Z축 E Class, X축 F Class, Y축 E Class로 측정됨.

전 방향 성능이 양호하며, VC-Class그래프를 첨부하였음.

Target equipment (TESCAN MIRA 3)

Vertical axis (Z) vibration level

Horizontal axis (X) vibration level

Horizontal axis (Y) vibration level

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Case Study Information

Category
Installation Report
SeriesDVIA-M Series
Date01-20-2017
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
DVIA-MB1000
MB1000
P39
TESCAN
MIRA3
Busan
Vibration measurement