Installation Report
DVIA-M Series
01-20-2017
Tier-1 Semiconductor TESCAN SEM (MIRA 3) DVIA-MB1000 (MB1000 P39) vibration environment measurement — 2017.01.18
DVIA-M Series
Installation Report
Tier-1 Semiconductor
DVIA-MB1000
MB1000
P39
TESCAN
MIRA3
Busan
Vibration measurement
Contents
MB1000 P39 vibration environment measurement results
(Tier-1 Semiconductor Busan campus)
Overview
제진대 설치 후 진동환경을 측정하여 장비 사용에 문제가 없는지 확인함.
Measurement facts
Measurement date: 2017-01-18 (Wed); measurer: Lim Jong-wook, DAEIL SYSTEMS
Measurement site: Tier-1 Semiconductor Busan campus
Business trip date: 2017-01-18 (Wed)
Report date: 2017-01-20 (Fri)
Field engineer: Lim Jong-wook, DAEIL SYSTEMS
Equipment model: TESCAN SEM (MIRA 3)
Measurement conditions and result summary
측정 조건: 제진대의 상판과 연구동 건물 바닥을 측정.
| Test Condition | VC-Class — Z | VC-Class — X | VC-Class — Y |
|---|---|---|---|
| 건물 바닥 | B | D | C |
| 제진대 상판 | E | F | E |
제진대가 설치된 바닥은 각각 Z축 B Class , X축 D Class, Y축 C Class로 측정됨.
제진대의 상부는 각각 Z축 E Class, X축 F Class, Y축 E Class로 측정됨.
전 방향 성능이 양호하며, VC-Class그래프를 첨부하였음.
Target equipment (TESCAN MIRA 3)
Vertical axis (Z) vibration level
Horizontal axis (X) vibration level
Horizontal axis (Y) vibration level
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Case Study Information
Category
Installation Report
SeriesDVIA-M Series
Date01-20-2017
Tags
DVIA-M Series
Installation Report
Tier-1 Semiconductor
DVIA-MB1000
MB1000
P39
TESCAN
MIRA3
Busan
Vibration measurement
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