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Installation Report
DVIA-ULF Series
05-26-2026

Tier-1 Semiconductor ZEISS Xradia Versa 730 DVIA-ULF1500 (260223R2) Installation Report

DVIA-ULF Series
Installation Report
Tier-1 Semiconductor
ZEISS
Xradia Versa 730
DVIA-ULF1500
260223R2

Customer

Tier-1 Semiconductor

Author

Engineer: Chaewon Lee

Installation date (header)

26.05.07

Report written date

26.05.14

Overview

Tuning and vibration measurements were conducted for the DVIA-ULF1500 installed in the Tier-1 Semiconductor DSR C Tower 3F research laboratory.

Inspection and vibration measurements were performed with the equipment in Turned off state.

Measured data are presented as VC curves, and reference materials on vibration levels are provided.

Vibration isolation platform

Model: DVIA-ULF1500

Serial Number: 260223R2

Engineer

Chaewon Lee — Field Engineer, DAEIL SYSTEMS Co., Ltd.

Tuning date

May 7, 2026

Installation location

Tier-1 Semiconductor DSR C Tower 3F research laboratory

End User

Tier-1 Semiconductor

Customer equipment

Manufacturer: ZEISS

Equipment: X-ray Microscope

Model: Xradia Versa 730

Equipment specification

VC-C

Equipment status

장비 설치 및 Turned off

Vibration measurement equipment

10.1) Data Physics DAQ

Hardware: QUATTRO, Serial Number: 22436

Software: SignalCalc ACE

10.2) Accelerometer

PCB Accelerometer

Model: 393B05

Vibration measurement setup

F Span: 200 Hz

Lines: 3200

Engineering Units: m/s

Window: Hanning

Averaging: FFT Spectrum Averaging

Averaging mode: Exponential, 40

Conclusion

Vibration specifications are met in all directions.

Measurement data

Measurement siteStateDirectionVibration specFloor vibrationDVIA-ULF1500Floor resultDVIA-ULF1500 result
Tier-1 Semiconductor DSR C Tower 3F research laboratory
1. Floor vibration
2. DVIA-ULF1500
Turned offVerticalVC-CVC-B @ 10 HzVC-D @ 10 HzFAILPASS
Left to RightVC-E @ 10 HzVC-F @ 10 HzPASSPASS
Front to BackVC-D @ 25 HzVC-F @ 25 HzPASSPASS

Data and image

Vertical VC Curves

Vertical Autospectrum

Vertical Transmissibility

Left to Right VC Curves

Left to Right Autospectrum

Left to Right Transmissibility

Front to Back VC Curves

Front to Back Autospecturm

Front to Back Transmissibility

Reference

Generic Vibration Criteria

Criterion CurveDescriptionAmplitude
μm/s (µin/s)
Detail Size
μm
Workshop (ISO)Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.800 (32,000)N/A
Office (ISO)Perceptible vibration. Appropriate to offices and non-sensitive areas.400 (16,000)N/A
Residential Area (ISO)Barely perceptible vibration. Appropriate to sleep areas in most instances.200 (8,000)75
Operating Theatre (ISO)Vibration not perceptible. Suitable for surgical suites, microscopes to 100x.100 (4,000)25
VC-AAdequate for optical microscopes to 400x, microbalances, optical balances.50 (2,000)8
VC-BAppropriate for inspection and lithography equipment to 3μm line widths.25 (1,000)3
VC-CAppropriate for optical microscopes to 1000x, lithography equipment to 1μm.12.5 (500)1 - 3
VC-DSuitable for demanding equipment including electron microscopes (SEMs/TEMs).6.25 (250)0.1 - 0.3
VC-EFor the most demanding systems including E-Beam lithography at nanometer scales.3.12 (125)< 0.1
VC-FFor extremely quiet research spaces. Not recommended as design criterion.1.56 (62.5)N/A
VC-GFor extremely quiet research spaces. Not recommended as design criterion.0.78 (31.25)N/A

Notes:

- As measured in one-third octave bands over 8-80 Hz (VC-A/B) or 1-80 Hz (VC-C through VC-G).

- Detail size refers to width in microelectronics fabrication or particle size in medical research.

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Case Study Information

Category
Installation Report
SeriesDVIA-ULF Series
Date05-26-2026
Tags
DVIA-ULF Series
Installation Report
Tier-1 Semiconductor
ZEISS
Xradia Versa 730
DVIA-ULF1500
260223R2