Espisystems Jarvis E Print Inspection Equipment DVIA-ULF1500 Installation Report
Contents
Overview
Tuning and vibration measurements were conducted for the DVIA-ULF1500 installed at the Espisystems 1F equipment room.
Tuning and vibration measurements were performed with the equipment installed and in a Turned off state.
Measurement data are presented as VC curves, together with reference materials on vibration levels.
Vibration Isolation System Information
Model: DVIA-ULF1500
Serial Number: 250904R1
Engineer
Chaewon Lee from DAEIL SYSTEMS
Measurement Date
November 18, 2025
Installation Site
Espisystems 1F equipment room
End User
Espisystems
Customer Equipment
N/A
Equipment specification
Manufacturer: Espisystems
Equipment: Print inspection equipment (printing mold)
Model: Jarvis E
Equipment Status
장비 설치 및 Turned on/IDLE
Measuring Equipment
Data Physics DAQ
- Hardware: QUATTRO, Serial Number: 22436
- Software: SignalCalc ACE
Accelerometer: PCB Accelerometer
Model: 393B05
Measuring Set-up
F Span: 200 Hz
Lines: 3200
Engineering Units: m/s
Window: Hanning
Averaging: FFT Spectrum Averaging
Averaging mode: Exponential, 40
Conclusion
In the 1–2 Hz range in all directions, isolation performance is approximately 50–70%; at frequencies above 2 Hz, isolation performance is 90% or higher.
Measurement Data
| Measuring site | State | Direction | Floor vibration | DVIA-ULF1500 |
|---|---|---|---|---|
| Espisystems 1F equipment room 1. Floor vibration 2. DVIA-ULF1500 | Turned off | Vertical | VC-C @ 80 Hz | VC-G @ 80 Hz |
| Left to Right | VC-E @ 50 Hz | VC-G @ 50 Hz | ||
| Front to Back | VC-E @ 50 Hz | VC-G @ 50 Hz |
Data and Image
Vertical VC Curves
Vertical Autospectrum
Vertical Transmissibility
Left to Right VC Curves
Left to Right Autospectrum
Left to Right Transmissibility
Front to Back VC Curves
Front to Back Autospectrum
Front to Back Transmissibility
Reference
Generic Vibration Criteria
Notes:
1. VC-A/B is measured in 1/3 octave bands from 8-80 Hz, VC-C through VC-G from 1-80 Hz.
2. Detail size refers to line widths in microelectronics manufacturing or particle sizes in medical research.
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