Tier-1 Semiconductor DVIA-U850 (230724R1) service report — Cheonan facility
Contents
Overview
Following a relocation from I&I (Suwon) to the Tier-1 Semiconductor Cheonan site, DVIA-U850 platform service was requested regarding Left-to-Right / Front-to-Back behaviour above roughly 5–6 Hz; the October 8 visit did not reproduce 5–6 Hz peaks but documented elevated ~20 Hz floor vibration and reduced performance; a revisit on October 25 addressed these items.
Cable tension influencing the isolation top plate was relaxed; powering off the isolator-area fan attenuated ~20 Hz energy.
At the customer’s request, settling-time characterization and vibration runs under representative main-tool motion (Align / PBI / BLT modes; 0.05 G and 0.2 G low-stroke excitation) were added.
Engineer: Seong-Yoon Jeong · measurement date: 2024-10-25 · report written: 2024-10-30 (per worksheet).
Engineer
DAEIL SYSTEMS: Daehyun Kim (manager), Seong-Yoon Jeong (engineer)
Measurement Date
October 25, 2024
Installation Site
Tier-1 Semiconductor Cheonan Plant 1, 5th floor line
Measurement Equipment
10.1) Data Physics — Hardware: QUATTRO DP240; Software: SignalCalc ACE
10.2) Accelerometer — PCB 393B05
Measurement Setup
F Span: 200
Lines: 3200
Window: Hanning
Averaging: FFT Spectrum Averaging
Engineering Units: m/s²
Equipment vibration specification
VC-C (or two VC-class reduction per worksheet wording).
Conclusions
8.1) Issues. On October 8, stage rest exhibited ~20 Hz floor-related vibration signatures, degraded performance versus the VC intent, and specification non-compliance trends. Requests added settling-time characterization and vibrations under Align / PBI / BLT motions at 0.05 G and 0.2 G stroke.
8.2) Analysis / corrective path. Measurements singled out upper-deck airflow hardware; fan shutdown and relieving cable lash reduced coupling. Post-change transmissibility confirmed nominal isolator control. Suwon-vs-Cheonan comparative traces remain on file alongside this dataset; additional structural decoupling stayed with the fabsite owner per their scope statement.
Measurement results summary
Authoritative Pass/Fail and mixed-band cells follow the plots in Data and Images; tables below condense the onsite worksheets.
### 9.1 Isolator Active On (condensed)
| Condition | Site | Axis | Specification | Measurement | Judgement |
|---|---|---|---|---|---|
| Main-machine Off / Fan ON / ties on | DVIA-U850 | Vertical (Z) | VC-C | VC-D | ✓ PASS |
| DVIA-U850 | Left–right (X) | VC-B | N/A | ✗ FAIL | |
| DVIA-U850 | Front–back (Y) | VC-C | N/A | ✓ PASS | |
| Floor | Vertical (Z) | VC-B | N/A | ✗ FAIL | |
| Floor | Left–right (X) | VC-B | N/A | ✗ FAIL | |
| Floor | Front–back (Y) | VC-C | N/A | ✓ PASS | |
| Main-machine Off / Fan OFF / ties removed | DVIA-U850 | Vertical (Z) | VC-C | VC-D | ✓ PASS |
| DVIA-U850 | Left–right (X) | VC-E @ >2 Hz / VC-B @ <2 Hz | Curve | ✓ PASS / ✗ FAIL | |
| DVIA-U850 | Front–back (Y) | VC-E @ >2 Hz / VC-C @ <2 Hz | Curve | ✓ PASS / ✓ PASS | |
| Floor | Vertical (Z) | VC-B | N/A | ✗ FAIL | |
| Floor | Left–right (X) | VC-B | Curve | ✓ PASS | |
| Floor | Front–back (Y) | VC-C | N/A | ✓ PASS | |
| Main-machine On / Fan OFF / ties removed | DVIA-U850 | Vertical (Z) | VC-C | VC-D | ✓ PASS |
| DVIA-U850 | Left–right (X) | VC-D @ >2 Hz / VC-B @ <2 Hz | Curve | ✓ PASS / ✗ FAIL | |
| DVIA-U850 | Front–back (Y) | VC-C @ >2 Hz / VC-B @ <2 Hz | Curve | ✓ PASS / ✗ FAIL | |
| Floor | Vertical (Z) | VC-A | N/A | ✗ FAIL | |
| Floor | Left–right (X) | VC-B | N/A | ✗ FAIL | |
| Floor | Front–back (Y) | VC-B | N/A | ✗ FAIL | |
| Before relocation (Suwon) / Tool Off | DVIA-U850 | Vertical (Z) | VC-C | VC-E | ✓ PASS |
| DVIA-U850 | Left–right (X) | N/A | VC-F | ✓ PASS | |
| DVIA-U850 | Front–back (Y) | N/A | VC-F | ✓ PASS | |
| Floor | Vertical (Z) | VC-B | N/A | ✗ FAIL | |
| Floor | Left–right (X) | VC-B | N/A | ✗ FAIL | |
| Floor | Front–back (Y) | VC-B | N/A | ✗ FAIL |
### 9.2 Settling time bullets
Summaries track the onsite tables: Align 0.05 G Y achieves ≤0.3 s on all repeats; Align 0.2 G Y fails across repeats; PBI 0.05 G clears Z repeats while Y shows mixed repeats; PBI 0.2 G records mixed Z draws and Y draws with source dash entries; BLT 0.05 G shows mixed Z draws with all X passes; BLT 0.2 G passes every Z and X draw.
Data and Images
10.1. Vibration isolation performance (isolator Active On)
Condition: Main machine off, platform top fan ON, cable ties not removed
Vertical (Z) (1/3)
Vertical (Z) (2/3)
Vertical (Z) (3/3)
Left to right (X) (1/3)
Left to right (X) (2/3)
Left to right (X) (3/3)
Front to back (Y) (1/3)
Front to back (Y) (2/3)
Front to back (Y) (3/3)
Condition: Main machine off, platform top fan OFF, cable ties removed
Vertical (Z) (1/4)
Vertical (Z) (2/4)
Vertical (Z) (3/4)
Vertical (Z) (4/4)
Left to right (X) (1/5)
Left to right (X) (2/5)
Left to right (X) (3/5)
Left to right (X) (4/5)
Left to right (X) (5/5)
Front to back (Y) (1/3)
Front to back (Y) (2/3)
Front to back (Y) (3/3)
Condition: Main machine on, platform top fan OFF, cable ties removed
Vertical (Z) (1/3)
Vertical (Z) (2/3)
Vertical (Z) (3/3)
Left to right (X) (1/3)
Left to right (X) (2/3)
Left to right (X) (3/3)
Front to back (Y) (1/3)
Front to back (Y) (2/3)
Front to back (Y) (3/3)
Condition: Previous install site (Suwon), customer tool turned off
VC-curve (1/3)
VC-curve (2/3)
VC-curve (3/3)
Transmissibility
10.2. Settling time
Condition: Align, 0.05 G — Y direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Condition: Align, 0.2 G — Y direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Condition: PBI, 0.05 G — Y direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Condition: PBI, 0.05 G — Z direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Condition: PBI, 0.2 G — Y direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Condition: PBI, 0.2 G — Z direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Condition: BLT, 0.05 G — Z direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Condition: BLT, 0.05 G — X direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Condition: BLT, 0.2 G — Z direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Condition: BLT, 0.2 G — X direction
Round 1 — capture (1/2)
Round 1 — capture (2/2)
Round 2 — capture (1/2)
Round 2 — capture (2/2)
Round 3 — capture (1/2)
Round 3 — capture (2/2)
Reference
Notes:
1. VC-A/B is measured in 1/3 octave bands from 8-80 Hz, VC-C through VC-G from 1-80 Hz.
2. Detail size refers to line widths in microelectronics manufacturing or particle sizes in medical research.
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