Kunming Metallurgical Research Institute ZEISS Sigma 360 DVIA-ULFB700 Installation Report
Contents
Overview
Following the installation of DVIA-ULFB700 at Kunming, vibration measurement was performed.
Vibration measurement was conducted with the equipment in the IDLE state.
Data is represented in Autospectrum format, and reference material on the vibration level is provided.
Vibration Isolation System Information
Model: DVIA-ULFB700
Serial Number: 250107R2
Engineer
Juhyeok Kim, DAEIL SYSTEMS
Tuning Date
2026.05.18
End User
Kunming Metallurgical Research Institute Co., Ltd
Number of Tuning Trial
2nd
Site
Kunming
Equipment
Manufacturer: ZEISS
Equipment: FE-SEM
Model: Sigma 360
Vibration Specification
Vertical
| Frequency [Hz] | Allowable [mm/s² RMS] |
|---|---|
| 1-8 | 0.03 |
| 8-45 | 0.15 |
| 45-100 | 2 |
Horizontal
| Frequency [Hz] | Allowable [mm/s² RMS] |
|---|---|
| 1-10 | 0.04 |
| 10-20 | 0.17 |
| 20-70 | 0.3 |
| 70-100 | 2 |
Measurement Summary
Note: The allowable vibration values specified in the Zeiss Sigma 360 Site Preparation Guide are defined in terms of acceleration (mm/s² RMS). As the measurement data was acquired in velocity (m/s RMS), a direct comparison with the manufacturer's specification was not feasible. The acceleration-based specification was therefore converted to an equivalent velocity criterion, and the pass/fail evaluation was conducted against the converted values.
| Measurement Point | Vibration Specifications | Axis | Floor | DVIA-ULFB700 |
|---|---|---|---|---|
| 1. Floor 2. DVIA-ULFB700 | See Section 9 | Vertical | ✗ FAIL | ✓ PASS |
| Left to Right | ✓ PASS | ✓ PASS | ||
| Front to Back | ✓ PASS | ✓ PASS |
Measurement Data
Vertical — Autospectrum
Left to Right — Autospectrum
Front to Back — Autospectrum
Equipment Photo
Reference
The table below classifies vibration levels based on IEST-RP-CC012.2.
Notes:
1. As measured in one-third octave bands of frequency over the frequency 8 to 80 Hz (VC-A and VC-B) or 1 to 80 Hz (VC-C through VC-G).
2. The detail size refers to line width in the case of microelectronics fabrication, the particle (cell) size in the case of medical and pharmaceutical research, etc.
3. The detail size is not relevant to imaging associated with probe technologies, AFMs, and nanotechnology.
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